AQ1052N2C [TAIYO YUDEN]
General Purpose Inductor, 0.0022uH, Ferrite-Core, 0402,;
| 型号： | AQ1052N2C |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | General Purpose Inductor, 0.0022uH, Ferrite-Core, 0402, 电感器 |
| 文件： | 总19页 (文件大小：573K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2010. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
notice_e-01
MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY
HIGH Q TYPE AQ SERIES
（
）
REFLOW
■ FEATURES
■ APPLICATIONS
◦ꢀHigh frequency inductors with high Q and high SRF suitable for high
◦Mꢀ obile telephone, Wireless LAN
◦Hꢀ igh frequency module
◦Tꢀ uner
frequency circuit.
◦ꢀEasy mounting and heat-resistance suitable for replacement of wire-
wound inductors.
◦Hꢀ igh-frequency circuits
◦ꢀE24 series lineup in a range from 2nH to 10nH makes circuit design
easy.
◦ꢀMonolithic structure provides high-reliability.
■ ORDERING CODE
A Q 1 0 5 1 0 N J － T
❶
❷
❸
❹
❺
❶Type
Chip inductors for high
frequency High Q type
❷External Dimensions
〔mm〕
105（0402） 1.0×0.6
❸Nominal Inductance〔nH〕
Example
❹Inductance Tolerances
❺Packaging
－T Tape & Reel
H
±3%
±5%
AQ
3N9
10N
3.9
J
10
C
S
±0.2nH
±0.3nH
*N＝0.0（nH type）
■ EXTERNAL DIMENSIONS/STANDARD QUANTITY
●AQ Type
Standard Quantity［pcs］
Paper Tape Embossed Tape
Type
L
W
T
e
AQ105
（0402）
1.0±0.05
0.6±0.1
0.5±0.05
0.175±0.075
10000
－
（0.039±0.002） （0.024±0.004） （0.020±0.002） （0.007±0.003）
Unit：mm（inch）
■ AVAILABLE INDUCTANCE RANGE
Inductance［nH］
AQ105
（Imax. [mA]）
Operating temp.:
－55～＋125℃
Operating temp.:
－55～＋85℃
1.0
1N0□
710
1.2
1N2□
710
1.5
1N5□
710
1.8
1N8□
710
2.2
2N2□
660
2.7
2N7□
630
3.3
3N3□
540
3.9
3N9□
490
4.7
4N7□
450
5.6
5N6□
420
6.8
6N8○
390
8.2
8N2○
360
10.0
10N○
330
12.0
15.0
15N○
280
12N○
300
930
930
930
930
870
820
710
630
590
550
510
470
440
390
360
※ □, ○mark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nH（□）, ±5％（○）is also available. Please contact your local sales office.
■ PART NUMBERS
●AQ105
Self-resonant
frequency
〔MHz〕
Rated
current
〔mA〕max.
DC.Resistance
〔Ω〕
Q（Typical）Frequency [MHz]
EHS（Environmental
LQ Measuring
frequency
[MHz]
Thickness
〔mm〕
（inch）
Inductance
〔nH〕
Ｑ
min.
Ordering code
Hazardous
Substances
）
－55～
－55～
300 800 900 1500 1800 min.
Typ.
max. Typ.
＋125℃
+85℃
AQ 105 1N0□
AQ 105 1N2□
AQ 105 1N5□
AQ 105 1N8□
AQ 105 2N0□
AQ 105 2N2□
AQ 105 2N4□
AQ 105 2N7□
AQ 105 3N0□
AQ 105 3N3□
AQ 105 3N6□
AQ 105 3N9□
AQ 105 4N3□
AQ 105 4N7□
AQ 105 5N1□
AQ 105 5N6□
AQ 105 6N2□
AQ 105 6N8○
AQ 105 7N5○
AQ 105 8N2○
AQ 105 9N1○
AQ 105 10N○
AQ 105 12N○
AQ 105 15N○
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0±0.3nH
1.2±0.3nH
1.5±0.3nH
1.8±0.3nH
2.0±0.3nH
2.2±0.3nH
2.4±0.3nH
2.7±0.3nH
3.0±0.3nH
3.3±0.3nH
3.6±0.3nH
3.9±0.3nH
4.3±0.3nH
4.7±0.3nH
5.1±0.3nH
5.6±0.3nH
6.2±0.3nH
6.8±5%
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
53 129 147 217 244 10000 ＞13000 0.07 0.014 710 930
97 110 156 177 10000 ＞13000 0.07 0.016 710 930
76 104 116 8000 ＞13000 0.07 0.030 710 930
45
35
32
38
37
34
30
31
32
33
34
29
30
30
30
31
28
28
29
29
28
26
25
69
61
68
67
54
49
51
54
53
53
47
48
48
48
49
44
45
46
45
45
40
38
66
73
71
59
52
54
57
56
56
50
51
51
51
52
49
50
50
49
48
45
42
92 100
94 103
92 101
6000
6000
6000
6000
6000
6000
6000
5000
4000
4000
4000
4000
4000
3900
3900
3700
3600
3400
3200
2700
2300
11000
10500
10000
9600
9200
8700
8300
7800
7300
6900
6400
6300
6200
6100
6000
5500
5000
4800
4500
4300
4100
0.07 0.035 710 930
0.08 0.035 660 870
0.08 0.040 660 870
0.09 0.050 630 820
0.09 0.060 630 820
0.11 0.070 570 740
0.12 0.075 540 710
0.14 0.080 500 650
0.15 0.085 490 630
0.16 0.090 470 610
0.17 0.095 450 590
0.19 0.110 430 560
0.20 0.120 420 550
0.22 0.130 400 520
0.23 0.130 390 510
0.25 0.135 370 490
0.27 0.140 360 470
0.29 0.150 350 450
0.31 0.165 330 440
0.39 0.165 300 390
0.45 0.190 280 360
74
67
70
72
71
70
64
65
64
65
66
59
60
62
59
57
51
49
86
73
76
79
77
76
71
72
71
71
72
64
65
66
62
60
52
51
0.50±0.05
（0.020±0.002）
7.5±5%
8.2±5%
9.1±5%
10±5%
12±5%
15±5%
※ □, ○mark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nH（□）, ±5％（○）is also available. Please contact your local sales office.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci06_e-01
80
■ ELECTRICAL CHARACTERISTICS
Q-Characteristics
■
Measured by HP8719C
AQ105
140
120
2N2
100
80
10N
60
40
20
0.01
0.1
1
10
■ Impedance-vs-Frequency characteristics
Measured by HP8719C
AQ105
100000
10000
1000
100
10
10N
2N2
1
0.01
0.1
1
10
■ Inductance-vs-Frequency characteristics
Measured by HP8719C
AQ105
50
40
30
20
10N
10
2N2
0.01
0.1
1
10
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci06_e-01
81
■ PACKAGING
①Minimum Quantity
②Taping material
◦Tape & Reel Packaging
C K
C K
C K S 2125
L K
L K
L K
H K
H K
H K
1608
2125
Standard Quantity［pcs］
Paper Tape Embossed Tape
Thickness
［mm］（inch）
Type
1005
1608
2125
0603
1005
1608
0.8
CK1608（0603）
4000
ー
（0.031）
0.85
4000
ー
ー
2000
ー
（0.033）
1.25
CK2125（0805）
CKS2125（0805）
H K Q 0603
（0.049）
0.85
A Q
B K
B K
B K
B K
B K
B K
B K P 0603
B K P 1005
B K P 1608
B K P 2125
105
0402
0603
1005
1608
2125
2010
4000
ー
（0.033）
1.25
2000
3000
3000
3000
3000
2000
3000
2000
ー
（0.049）
0.9
CKP2012（0805）
CKP2016（0806）
ー
（0.035）
0.9
ー
（0.035）
0.7
ー
（0.028）
0.9
C K
2125
CKP2520（1008）
ー
C K S 2125
C K P 2012
C K P 2016
C K P 2520
N M
N M
L K
H K
B K
B K
（0.035）
1.1
ー
（0.043）
0.9
2012
2520
2125
2125
2125
3216
NM2012（0805）
NM2520（1008）
LK1005（0402）
LK1608（0603）
ー
（0.035）
1.1
ー
（0.043）
0.5
10000
4000
4000
ー
（0.020）
0.8
ー
（0.031）
0.85
ー
（0.033）
1.25
LK2125（0805）
2000
ー
（0.049）
0.3
③Taping Dimensions
HK0603（0201）
HK1005（0402）
HK1608（0603）
15000
10000
4000
ー
（0.012）
0.5
◦Paper tape (0.315 inches wide)
ー
（0.020）
0.8
ー
（0.031）
0.85
4000
3000
ー
（0.033）
1.0
HK2125（0805）
ー
（0.039）
0.3
HKQ0603S（0201）
AQ105（0402）
15000
10000
20000
15000
10000
4000
4000
ー
（0.012）
0.5
ー
Unit : mm（inch）
（0.020）
0.2
BK0402（01005）
BK0603（0201）
BK1005（0402）
BK1608（0603）
ー
（0.008）
0.3
Insertion
Tape
Thickness
ー
Thickness
Chip cavity
（0.012）
0.5
Pitch
Type
〔mm〕
（inch）
A
B
F
T
ー
（0.020）
0.8
0.8
1.0±0.2
1.8±0.2
4.0±0.1
1.1ｍａｘ
CK1608（0603）
CK2125（0805）
CKS2125（0805）
LK1005（0402）
LK1608（0603）
LK2125（0805）
HK0603（0201）
HK1005（0402）
HK1608（0603）
HKQ0603S（0201）
AQ105（0402）
BK0402（01005）
BK0603（0201）
（0.031）（0.039±0.008）（0.071±0.008）（0.157±0.004） （0.043max）
ー
（0.031）
0.85
0.85
（0.033）（0.059±0.008）（0.091±0.008）（0.157±0.004） （0.043max）
0.85 1.5±0.2 2.3±0.2 4.0±0.1 1.1ｍａｘ
（0.033）（0.059±0.008）（0.091±0.008）（0.157±0.004） （0.043max）
0.5 0.65±0.1 1.15±0.1 2.0±0.05 0.8ｍａｘ
（0.020）（0.026±0.004）（0.045±0.004）（0.079±0.002） （0.031max）
0.8 1.0±0.2 1.8±0.2 4.0±0.1 1.1ｍａｘ
（0.031）（0.039±0.008）（0.071±0.008）（0.157±0.004） （0.043max）
0.85 1.5±0.2 2.3±0.2 4.0±0.1 1.1ｍａｘ
（0.033）（0.059±0.008）（0.091±0.008）（0.157±0.004） （0.043max）
0.3 0.40±0.06 0.70±0.06 2.0±0.05 0.45ｍａｘ
（0.012）（0.016±0.002）（0.028±0.002）（0.079±0.002） （0.018max）
0.5 0.65±0.1 1.15±0.1 2.0±0.05 0.8ｍａｘ
（0.020）（0.026±0.004）（0.045±0.004）（0.079±0.002） （0.031max）
0.8 1.0±0.2 1.8±0.2 4.0±0.1 1.1ｍａｘ
（0.031）（0.039±0.008）（0.071±0.008）（0.157±0.004） （0.043max）
0.3 0.40±0.06 0.70±0.06 2.0±0.05 0.45ｍａｘ
（0.012）（0.016±0.002）（0.028±0.002）（0.079±0.002） （0.018max）
0.5 0.75±0.1 1.15±0.1 2.0±0.05 0.8ｍａｘ
（0.020）（0.030±0.004）（0.045±0.004）（0.079±0.002） （0.031max）
0.2 0.25±0.04 0.45±0.04 2.0±0.05 0.36ｍａｘ
（0.008）（0.010±0.002）（0.018±0.002）（0.079±0.002） （0.014max）
0.3
1.5±0.2
2.3±0.2
4.0±0.1
1.1ｍａｘ
ー
（0.033）
1.25
BK2125（0805）
2000
ー
（0.049）
0.45
BK2010（0804）
BK3216（1206）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
4000
ー
（0.018）
0.8
4000
ー
（0.031）
0.3
15000
10000
4000
4000
（0.012）
0.5
ー
（0.020）
0.8
ー
（0.031）
0.85
ー
（0.033）
0.40±0.06
0.70±0.06
2.0±0.05
0.45ｍａｘ
（0.012）（0.016±0.002）（0.028±0.002）（0.079±0.002） （0.018max）
To next page
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP1
■ PACKAGING
⑤Reel Size
Insertion
Pitch
Tape
Thickness
Thickness
Chip cavity
Type
〔mm〕
（inch）
A
B
F
T
2.0±0.5
0.5
0.65±0.1
1.15±0.1
2.0±0.05
0.8ｍａｘ
（0.079±0.031）
BK1005（0402）
BK1608（0603）
BK2125（0805）
BK2010（0804）
BKP0603（0201）
BKP1005（0402）
BKP160（8 0603）
BKP2125（0805）
（0.020）（0.026±0.004）（0.045±0.004）（0.079±0.002） （0.031max）
φ13.0±0.2
0.8
（0.031）（0.039±0.008）（0.071±0.008）（0.157±0.004） （0.043max）
0.85 1.5±0.2 2.3±0.2 4.0±0.1 1.1ｍａｘ
（0.033）（0.059±0.008）（0.091±0.008）（0.157±0.004） （0.043max）
0.45 1.2±0.1 2.17±0.1 4.0±0.1 0.8ｍａｘ
（0.018）（0.047±0.004）（0.085±0.004）（0.157±0.004） （0.031max）
0.3 0.40±0.06 0.70±0.06 2.0±0.05 0.45ｍａｘ
（0.012）（0.016±0.002）（0.028±0.002）（0.079±0.002） （0.018max）
0.5 0.65±0.1 1.15±0.1 2.0±0.05 0.8ｍａｘ
（0.020）（0.026±0.004）（0.045±0.004）（0.079±0.002） （0.031max）
0.8 1.0±0.2 1.8±0.2 4.0±0.1 1.1ｍａｘ
（0.031）（0.039±0.008）（0.071±0.008）（0.157±0.004） （0.043max）
0.85
1.0±0.2
1.8±0.2
4.0±0.1
1.1ｍａｘ
（φ0.512±0.020）
1.5±0.2
2.3±0.2
4.0±0.1
1.1ｍａｘ
（0.033）（0.059±0.008）（0.091±0.008）（0.157±0.004） （0.043max）
Unit : mm（inch）
⑥Top tape strength
◦Embossed Tape (0.315 inches wide)
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as
illustrated below.
Unit : mm（inch）
Insertion
Pitch
Tape
Thickness
Thickness
〔mm〕
（inch）
Chip cavity
Type
A
B
F
K
T
1.25
1.5±0.2
2.3±0.2
4.0±0.1
2.0
0.3
CK2125（0805）
CKS2125（0805）
CKP2012（0805）
CKP2016（0806）
（0.049） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.079）（0.012）
1.25
（0.049） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.079）（0.012）
0.9 1.55±0.2 2.3±0.2 4.0±0.1 1.3 0.3
（0.035） （0.061±0.008） （0.091±0.008） （0.157±0.004） （0.051）（0.012）
0.9 1.8±0.1 2.2±0.1 4.0±0.1 1.3 0.25
（0.035） （0.071±0.004） （0.087±0.004） （0.157±0.004） （0.051） （0.01）
1.5±0.2
2.3±0.2
4.0±0.1
2.0
0.3
0.7
1.4
（0.028）
（0.055）
0.9
2.3±0.1
2.8±0.1
4.0±0.1
1.4
0.3
CKP2520（1008）
（0.035） （0.091±0.004） （0.110±0.004） （0.157±0.004） （0.055）（0.012）
1.1
1.7
（0.043）
（0.067）
0.9
1.55±0.2
2.3±0.2
4.0±0.1
1.3
0.3
NM2012（0805）
NM2520（1008）
LK2125（0805）
（0.035） （0.061±0.008） （0.091±0.008） （0.157±0.004） （0.051）（0.012）
1.1 2.3±0.1 2.8±0.1 4.0±0.1 1.7 0.3
（0.043） （0.091±0.004） （0.110±0.004） （0.157±0.004） （0.067）（0.012）
1.25 1.5±0.2 2.3±0.2 4.0±0.1 2.0 0.3
（0.049） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.079）（0.012）
0.85
1.5
（0.033）
1.0
（0.059）
2.0
1.5±0.2
2.3±0.2
4.0±0.1
0.3
（0.012）
HK2125（0805）
（0.059±0.008） （0.091±0.008） （0.157±0.004）
（0.039）
（0.079）
1.25
1.5±0.2
2.3±0.2
4.0±0.1
2.0
0.3
BK2125（0805）
BK3216（1206）
（0.049） （0.059±0.008） （0.091±0.008） （0.157±0.004） （0.079）（0.012）
0.8 1.9±0.1 3.5±0.1 4.0±0.1 1.4 0.3
（0.031） （0.075±0.004） （0.138±0.004） （0.157±0.004） （0.055）（0.012）
④LEADER AND BLANK PORTION
160mm or more
100mm or more
（
6.3inches or more
）
（3.94inches or more）
400mm ore more
Direction of tape feed
（15.7inches or more）
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP2
■ RELIABILITY DATA
Multilayer chip inductors and beads
1. Operating Temperature Range
BK0402
BK0603
BK1005
BK1608
BK2125
－55～＋125℃
－55～＋85℃
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
－40～＋85℃
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
－55～＋125℃
－40～＋85℃
－55～＋125℃
2. Storage Temperature Range
BK0402
BK0603
BK1005
BK1608
BK2125
－55～＋125℃
－55～＋85℃
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
－40～＋85℃
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
－55～＋125℃
－40～＋85℃
－55～＋125℃
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP3
■ RELIABILITY DATA
Multilayer chip inductors and beads
3. Rated Current
BK0402
240～540mA DC
100～500mA ＤＣ
120～1000mA ＤＣ
150～1500mA ＤＣ
200～1200mA ＤＣ
100mA ＤＣ
BK0603
BK1005
BK1608
BK2125
BK2010
ARRAY
BK3216
100～200mA ＤＣ
1.0A ＤＣ
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
800～2000mA DC
1.0～3.0A ＤＣ
1.5～4.0A ＤＣ
50～60mA DC
60～500mA DC
110～280mA DC
0.7～1.2A DC
0.9～1.6A DC
1.1～1.8A DC
0.8～1.5A DC
0.9～1.1A DC
20～25mA DC
1～150mA DC
5～300mA DC
60～470mA DC
110～300mA DC
150～300mA DC
300mA DC
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
130～600mA DC
280～710mA DC
Definition of rated current：
・In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20℃.
・In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within 40℃.
・In the LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current
at which the temperature of the element is increased within 20℃.
4. Impedance
BK0402
BK0603
BK1005
BK1608
BK2125
10～120Ω ±25%
10～600Ω ±25%
10～1800Ω ±25%
22～2500Ω ±25%
15～2500Ω ±25%
5～1000Ω ±25%
68～1000Ω ±25%
22～33Ω ±25%
10～220Ω ±25%
33～470Ω ±25%
33～330Ω ±25%
BK2010
BK3216
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
——
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
BK0402 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4991A（or its equivalent）
Measuring jig：16196D（or its equivalent）
BK0603 Series, BKP0603 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4291A（or its equivalent）
Measuring jig：16193A（or its equivalent）
BK1005 Series, BKP1005 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4291A（or its equivalent）
Measuring jig：16192A（or its equivalent）, 16193A（or its equivalent）
BK1608・2125 Series, BKP1608・2125 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4291A（or its equivalent）, HP4195A（or its equivalent）
Measuring jig：16092A（or its equivalent）or 16192A（or its equivalent）/HW
BK2010・3216 Series
Measuring frequency：100±1MHz
Measuring equipment：HP4291A（or its equivalent）, HP4195A（or its equivalent）
Measuring jig：16192A（or its equivalent）
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP4
■ RELIABILITY DATA
Multilayer chip inductors and beads
5. Inductance
BK0402
BK0603
BK1005
BK1608
BK2125
BK2010
ARRAY
——
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
4.7～10.0μH：±20%
0.1～10.0μH：±20%
1.0～10.0μH：±20%
0.47～4.7μH：±20%
0.47～4.7μH：±20%
0.47～4.7μH：±20%
0.82～1.0μH：±20%
1.0～2.2μH：±20%
0.12～2.2μH：±10%ꢁQ 0.12～2.2μH：±30%
LK1608
0.047～33.0μH：±20%ꢁ0.10～12.0μH：±10%ꢁQ 0.12～2.2μH：±30%
0.047～33.0μH：±20%ꢁ0.10～12.0μH：±10%ꢁQ 0.12～2.2μH：±30%
1.0～6.2nH：±0.3nHꢁ6.8～100nH：±5%
1.0～6.2nH：±0.3nHꢁ6.8～270nH：±5%
1.0～5.6nH：±0.3nHꢁ6.8～470nH：±5%
1.5～5.6nH：±0.3nHꢁ6.8～470nH：±5%
0.6～6.2nH：±0.3nHꢁ6.8～22nH：±5%
1.0～6.2nH：±0.3nHꢁ6.8～15nH：±5%
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
CK Series：
Measuring frequency：2 to 4MHz（CK1608）
Measuring frequency：2 to 25MHz（CK2125）
Measuring frequency：2 to 10MHz（CKS2125）
LK Series：
Measuring frequency：10 to 25MHz（LK1005）
Measuring frequency：1 to 50MHz（LK1608）
Measuring frequency：0.4 to 50MHz（LK2125）
CKP Series, NM Series：
Measuring frequency：1MH（z CKP2012, CKP2016, CKP2520, NM2012・NM2520）
Measuring equipment, jig：・HP4194A＋16085B＋16092A（or its equivalent）
・HP4195A＋41951＋16092A（or its equivalent）
・HP4294A＋16192A（or its equivalent）
・HP4291A＋16193A（or its equivalent）/LK1005
・HP4285A＋42841A＋42842C＋42851－61100（CKP2012・CKP2016・CKP2520・NM2012・NM2520）
Measuring current：・1mA rm（s 0.047 to 4.7μH）ꢁ・0.1mA rm（s 5.6 to 33μH）
HK、HKQ、AQ Series：
Measuring frequency：100MH（z HK0603・HK1005・AQ105）
Measuring frequency：50/100MH（z HK1608・HK2125）
Measuring frequency：500MH（z HKQ0603S）
Measuring equipment, jig：・HP4291A＋16197A（or its equivalent）/HK0603・AQ105
・HP4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S
・HP4291A＋16092＋in-house made jig（or its equivalent）/HK1608・HK2125
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP5
■ RELIABILITY DATA
Multilayer chip inductors and beads
6. Q
BK0402
BK0603
BK1005
BK1608
BK2125
BK2010
ARRAY
——
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
20 min.
15～20 min.
——
10～20 min.
10～35 min.
15～50 min.
4～5 min.
8 min.
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
8～12 min.
10～18 min.
10～13 min.
8 min.
【Test Methods and Remarks】
CK Series：
Measuring frequency：2 to 4MH（z CK1608）
Measuring frequency：2 to 25MH（z CK2125）
LK Series：
Measuring frequency：10 to 25MH（z LK1005）
Measuring frequency：1 to 50MH（z LK1608）
Measuring frequency：0.4 to 50MH（z LK2125）
Measuring equipment, jig：・HP4194A＋16085B＋16092A（or its equivalent）
・HP4195A＋41951＋16092A（or its equivalent）
・HP4294A＋16192A（or its equivalent）
・HP4291A＋16193A（or its equivalent）/LK1005
Measuring current：・1mA rm（s 0.047 to 4.7μH）ꢁ・0.1mA rm（s 5.6 to 33μH）
HK、HKQ、AQ Series：
Measuring frequency：100MH（z HK0603・HK1005・AQ105）
Measuring frequency：50/100MH（z HK1608・HK2125）
Measuring frequency：500MH（z HKQ0603S）
Measuring equipment, jig：・HP4291A＋16197A（or its equivalent）/HK0603・AQ105
・HP4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S
・HP4291A＋16092A＋ in-house made jig（or its equivalent）/HK1608・HK2125
7. DC Resistance
BK0402
0.10～0.53Ω max.
0.065～1.50Ω max.
0.03～0.80Ω max.
0.05～1.10Ω max.
0.05～0.75Ω max.
0.10～0.90Ω max.
0.15～0.80Ω max.
0.065～0.070Ω max.
0.030～0.20Ω max.
0.025～0.18Ω max.
0.020～0.075Ω max.
0.45～0.85Ω（±30%）
0.16～0.65Ω max.
0.09～0.40Ω typ.
0.12～0.52Ω max.
0.10～0.28Ω max.
0.08～0.20Ω max.
0.05～0.16Ω max.
0.10～0.19Ω max.
0.13～0.22Ω max.
0.41～1.16Ω max.
0.2～2.2Ω max.
BK0603
BK1005
BK1608
BK2125
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
0.1～1.1Ω max.
HK0603
0.11～3.74Ω max.
0.08～4.8Ω max.
0.05～2.6Ω max.
0.10～1.5Ω max.
0.06～1.29Ω max.
0.07～0.45Ω max.
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
Measuring equipment：VOAC-7412（made by Iwasaki Tsushinki）ꢁVOAC-7512（made by Iwasaki Tsushinki）
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP6
■ RELIABILITY DATA
Multilayer chip inductors and beads
8. Self Resonance Frequenc（y SRF）
BK0402
BK0603
BK1005
BK1608
BK2125
BK2010
ARRAY
——
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
17～25MHz min.
24～235MHz min.
——
40～180MHz min.
LK1608
9～260MHz min.
LK2125
13～320MHz min.
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
900～10000MHz min.
400～10000MHz min.
300～10000MHz min.
200～4000MHz min.
1900～10000MHｚ min.
2300～10000MHz min.
【Test Methods and Remarks】
LK Series：
Measuring equipment：HP4195A（or its equivalent）
Measuring jig：41951＋16092A（or its equivalent）
HK、HKQ、AQ Series：
Measuring equipment：HP8719C（or its equivalent）・HP8753D（or its equivalent）/HK2125
9. Temperature Characteristic
BK0402
BK0603
BK1005
BK1608
BK2125
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
——
LK1608
LK2125
HK0603
HK1005
HK1608
Inductance change：Within ±10％
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
HK、HKQ、AQ Series：Temperature range：－30 to ＋85℃
Reference temperature：＋20℃
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP7
■ RELIABILITY DATA
Multilayer chip inductors and beads
10. Resistance to Flexure of Substrate
BK0402
BK0603
BK1005
BK1608
BK2125
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
No mechanical damage.
NM2520
LK1005
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
Warp：2mm（BK Series without 0402size, BKP, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series）
：1mm（BK0402 Series）
Testing board：glass epoxy-resin substrate
Thickness：0.8mm
11. Solderability
BK0402
BK0603
BK1005
BK1608
BK2125
BK2010
BK3216
At least 75％ of terminal electrode is covered by new solder.
ARRAY
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
At least 75％ of terminal electrode is covered by new solder.
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
【Test Methods and Remarks】
Solder temperature：230±5℃
Duration：4±1 sec.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP8
■ RELIABILITY DATA
Multilayer chip inductors and beads
12. Resistance to Soldering
BK0402
BK0603
BK1005
BK1608
BK2125
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change
R10～4R7 ：Within ±10％
6R8～100 ：Within ±15％
CKS2125 ：Within ±20％
CKP2012、CKP2016、CKP2520、NM2012、NM2520：Within ±30％
No mechanical damage.ꢁRemaining terminal electrode：70％ min.ꢁInductance change：Within ±15％
LK1608
No mechanical damage.
Remaining terminal electrode：70％ min.ꢁInductance changeꢁ47N～4R7：Within ±10％ꢁ5R6～330：Within ±15％
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
No mechanical damage.
Remaining terminal electrode：70％ min.ꢁInductance change：Within ±5％
【Test Methods and Remarks】
Solder temperature：260±5℃
Duration：10±0.5 sec.
Preheating temperature：150 to 180℃
Preheating time：3 min.
Flux：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery：2 to 3 hrs of recovery under the standard condition after the test（. See Note 1）
13. Thermal Shock
BK0402
BK0603
BK1005
BK1608
BK2125
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
No mechanical damage.
Inductance change：Within ±20％ꢁQ change：Within ±30％
Inductance change：Within ±20％（CKS2125）
No mechanical damage.ꢁInductance change：Within ±30％
No mechanical damage.
Inductance change：Within ±10％ꢁQ change：Within ±30％
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
No mechanical damage.
Inductance change：Within ±10％ꢁQ change：Within ±20％
HKQ0603S
AQ105
【Test Methods and Remarks】
Conditions for 1 cycle
Step 1：Minimum operating temperature
Step 2：Room temperature 2 to 3 min.
＋0
－3
℃ 30±3 min.
＋3
－0
Step 3：Maximum operating temperature
Step 4：Room temperature 2 to 3 min.
Number of cycles：5
℃ 30±3 min.
Recovery：2 to 3 hrs of recovery under the standard condition after the test（. See Note 1）
(Note 1) When there are questions concerning mesurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP9
■ RELIABILITY DATA
Multilayer chip inductors and beads
14. Damp Heat（Steady state）
BK0402
BK0603
BK1005
BK1608
BK2125
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
No mechanical damage.
Inductance change：Within ±20％ꢁQ change：Within ±30％
Inductance change：Within ±20％
No mechanical damage.ꢁInductance change：Within ±30％
No mechanical damage.
Inductance change：Within ±10％ꢁQ change：Within ±30％
LK1608
LK2125
No mechanical damage.ꢁInductance change：Within ±20％ꢁQ change：Within ±30％
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
No mechanical damage.
Inductance change：Within ±10％ꢁQ change：Within ±20％
【Test Methods and Remarks】
BK Series：
Temperature：40±2℃
Humidity：90 to 95％RH
＋24
Duration：500
hrs
－0
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber（. See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ Series：
Temperature：40±2℃（LK、CK、CKS、CKP、NM Series）
：60±2℃（HK、HKQ、AQ Series）
Humidity：90 to 95％RH
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber（. See Note 1）
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP10
■ RELIABILITY DATA
Multilayer chip inductors and beads
15. Loading under Damp Heat
BK0402
BK0603
BK1005
BK1608
BK2125
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
No mechanical damage.
Inductance change：Within ±20％ꢁQ change：Within ±30％
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
No mechanical damage.ꢁInductance change：Within ±20％
No mechanical damage.ꢁInductance change：Within ±30％
No mechanical damage.ꢁInductance change：Within ±10％ꢁQ change：Within ±30％
No mechanical damage.
LK1608
Inductance change：0.047 to 12.0μH：Within ±10％ꢁ15.0 to 33.0μH：Within ±15％ꢁQ change：Within ±30％
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
No mechanical damage.ꢁInductance change：Within ±20％ꢁQ change：Within ±30％
No mechanical damage.
Inductance change：Within ±10％ꢁQ change：Within ±20％
【Test Methods and Remarks】
BK Series：
Temperature：40±2℃
Humidity：90 to 95％RH
Applied current：Rated current
＋24
Duration：500
hrs
－0
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber（. See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ Series：
Temperature：40±2℃（LK、CK、CKS、CKP、NM Series）
：60±2℃（HK、HKQ、AQ Series）
Humidity：90 to 95％RH
Applied current：Rated current
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber（. See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP11
■ RELIABILITY DATA
Multilayer chip inductors and beads
16. Loading at High Temperature
BK0402
BK0603
BK1005
BK1608
BK2125
Appearance：No significant abnormality
Impedance change：Within ±30％
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
No mechanical damage.
Inductance change：Within ±20％ꢁQ change：Within ±30％
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
No mechanical damage.ꢁInductance change：Within ±20％
No mechanical damage.ꢁInductance change：Within ±30％
No mechanical damage.ꢁInductance change：Within ±10％ꢁQ change：Within ±30％
No mechanical damage.
LK1608
Inductance change：0.047 to 12.0μH：Within ±10％ꢁ15.0 to 33.0μH：Within ±15％ꢁQ change：Within ±30％
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0603S
AQ105
No mechanical damage.ꢁInductance change：Within ±20％ꢁQ change：Within ±30％
No mechanical damage.
Inductance change：Within ±10％ꢁQ change：Within ±20％
【Test Methods and Remarks】
BK Series：
Temperature：125±3℃
Applied current：Rated current
＋24
Duration：500
hrs
－0
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber（. See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ、BKP Series：
Temperature：85±2℃（LK、CK、CKS、CKP、NM、BKP Series）
：85±2℃（HK1608，2125）
：85±2℃（HK1005, AQ105 operating temperature range －55 to ＋85℃）
：125±2℃（HK0603, HK1005, HKQ0603S, AQ105 operating temperature range －55 to ＋125℃）
Applied current：Rated current
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the test（. See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless other-
wise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP12
■ PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from
Precautions
components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
◆Pattern configuration（s Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1）The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when
designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of
solder necessary to form the fillets.
（2）When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated
Precautions
by solder-resist.
（3）The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns
smaller than terminal electrode of chips.
◆Pattern configuration（s Inductor layout on panelized［breakaway］PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes（PCB cutting,
board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.）For this reason, planning pattern
configurations and the position of SMD inductors should be carefully performed to minimize stress.
◆Pattern configuration（s Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amount（s larger fillets which extend above
the component end terminations）. Examples of improper pattern designs are also shown.
（1）Recommended land dimensions for a typical chip inductor land patterns for PCBs
Recommended land dimensions for wave-soldering
Recommended land dimensions for reflow-soldering
Type
L
1608
1.6
2125
2.0
3216
3.2
Type
L
0402
0.4
0603
0.6
1005
1.0
105
1.0
0.6
1608
1.6
2012
2.0
2125
2.0
2016
2.0
3216
3.2
2520
2.5
W
A
0.8
1.25
1.6
W
A
0.2
0.3
0.5
0.8
1.25
1.25
1.6
1.6
2.0
0.8～1.0 1.0～1.4 1.8～2.5
0.5～0.8 0.8～1.5 0.8～1.7
0.6～0.8 0.9～1.2 1.2～1.6
（Unit：mm）
0.15～0.25 0.20～0.30 0.45～0.55 0.50～0.55 0.8～1.0 0.8～1.2 0.8～1.2 0.8～1.2 1.8～2.5 1.0～1.4
0.10～0.20 0.20～0.30 0.40～0.50 0.30～0.40 0.6～0.8 0.8～1.2 0.8～1.2 0.8～1.2 0.6～1.5 0.6～1.0
0.15～0.30 0.25～0.40 0.45～0.55 0.60～0.70 0.6～0.8 0.9～1.6 0.9～1.6 1.2～2.0 1.2～2.0 1.8～2.2
（Unit：mm）
B
B
C
C
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.
Recommended land dimension for Reflow-soldering
Type
L
3216
3.2
2010
2.0
W
a
1.6
1.0
0.7～0.9 0.5～0.6
0.8～1.0 0.5～0.6
0.4～0.5 0.2～0.3
Technical
consider-
ations
b
c
d
0.8
0.5
（Unit：mm）
（2）Examples of good and bad solder application
Item
Not recommended
Recommended
Mixed mounting of SMD
and leaded components
Component placement
close to the chassis
Hand-soldering of leaded
components near mounted
components
Horizontal component
placement
To next page
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP13
■ PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
2. PCB Design
◆Pattern configuration（s Inductor layout on panelized［breakaway］PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board
warp or deflection.
Item
Not recommended
Recommended
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout.
An example below should be counted for better design.
Technical
consider-
ations
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following
methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must
also consider the PCB splitting procedure.
3. Considerations for automatic placement
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
Precautions ◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following
factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is
imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be
considered before lowering the pick-up nozzle:
（1）The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board.
（2）The pick-up pressure should be adjusted between 1 and 3N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC
board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Improper method
Proper method
Single-sided mounting
Double-sided mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the
inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the
pin should be conducted periodically.
Technical
consider-
ations
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may
result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component
placement, so the following precautions should be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2）When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too
little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive
flow of adhesive on to the land or solder pad.
［Recommended conditions］
Figure
0805 case sizes as examples
0.3mm min
a
b
c
100～120μm
Area with no adhesive
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP14
■ PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
4. Soldering
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1）Flux used should be with less than or equal to 0.1 wt%（Chlorine conversion method）of halogenated content. Flux having a strong acidity content should
not be applied.
Precautions
（2）When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3）When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak tem-
perature when you use lead-free paste.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue
after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect
solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may
cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines
used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be
conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
［Reflow soldering］
Temperature profile
Temperature（℃）
（Pb free soldering）
300
Peak 260℃ max
10 sec max
200
100
0
Gradually
cooling
Preheating
150℃
60 sec min
Heating above 230℃
40 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mas（s fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below:
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.
Technical
consider-
ations
［Wave soldering］
Temperature profile
Temperature（℃）
（Pb free soldering）
300
Peak 260℃ max
10 sec max
200
100
0
Gradually
cooling
Preheating
150℃
120 sec min
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
Temperature profile
Temperature（℃）
（Pb free soldering）
400
350℃ max
3 sec max
300
200
Gradually
cooling
⊿Ｔ
100
0
60 sec min
（※⊿ＴT190℃（3216Type max）, ⊿Ｔ≦ 130℃（3225
Type ming）
※It is recommended to use 20W soldering iron and
the tip is 1φor less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP15
■ PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
5. Cleaning
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of
the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics.
Precautions
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's
electrical propertie（s especially insulation resistance）.
2. Inappropriate cleaning condition（s insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
Technical
consider-
ations
（1）Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor
or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;
Ultrasonic output
Ultrasonic frequency
Ultrasonic washing period
Below 20W/ℓ
Below 40kHz
5 min. or less
6. Post cleaning processes
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal
storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor
damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
Precautions
7. Handling
The use of such resins, molding materials etc. is not recommended.
◆Breakaway PC board（s splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
Precautions
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors（soldering irons, measuring instruments）should be properly grounded.
5. Keep bare hands and metal product（s i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1）If inductors are dropped on the floor or a hard surface they should not be used.
（2）When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and
humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature Below 40℃
Precautions
Humidity
Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so
inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
◆Storage
Technical
consider-
ations
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the inductors.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP16
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